TITLE

QUALCOMM INCREASES DIE SIZE >40%

PUB. DATE
August 2013
SOURCE
Modem Users News;Aug2013, Vol. 25 Issue 8, p1
SOURCE TYPE
Trade Publication
DOC. TYPE
Product Review
ABSTRACT
The article offers information on the 8974 combination application/communication processor with increased die area of 40% from Qualcomm Inc.
ACCESSION #
93994647

 

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