Cure Monitoring of Thermosets Using Disc Bimorph Transducers

December 2014
Solid State Phenomena;2014, Vol. 220-221, p380
Academic Journal
The article discusses the results of experiments on the further development of the method for monitoring the state of the small samples of resin and polymers during curing. The applied method is based on a change in the structure of oscillating transducers leading to variations in the form and/or mode of oscillation. The thin layer of epoxy resin was placed between two piezoelectric transducers in the form of piezoceramic plates. Curing epoxy resin forms a bimorph and its characteristics change along with variations in viscosity or, after the gel point, stiffness. It is possible to establish the level of epoxy resin curing by monitoring changes in the resonance parameters of bimorph elements. The main purpose of cure monitoring of small samples is to develop a new method for evaluating the parameters of resin both before and after the gel point thus taking into consideration that the use of rheological data measured with reference to small samples will be applied for designing or interpreting bulk-flow processes where epoxy may be considered a continuum.


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